This technology integrates inductive components directly onto a silicon wafer, facilitating efficient energy transfer and magnetic field interaction in the circuit. Using semiconductor wafer-level manufacturing processes, these inductors are created through the deposition of metal and dielectric layers, employing a 3D structure that allows for easy patterning. It is particularly advantageous for applications that require inductance greater than 10nH, resulting in notable space savings on circuit boards. These wafer-level inductors exhibit high inductance values and quality factors, meeting the high-performance requirements of circuits and enhancing chip stability and uniformity.

Acknowledging the mechanical misalignment that can occur between rotors and stators, we provide clients with a complete solution for inductive position sensors. This encompasses magnetic field modeling, simulation technologies, coil design, and guidance for rotor and stator PCB design, ensuring optimal sensor performance and accuracy. By working with leading domestic R&D teams and utilizing our in-house process and testing facilities, we conduct thorough electrical performance evaluations at both the wafer and system levels, consistently striving to deliver efficient and reliable products to our customers.